At the on-going CES 2021, Qualcomm has announced its latest 3D Sonic Sensor Gen 2, which is the latest version of the ultrasonic in-display fingerprint sensor from the company. It is aiming to offer improvement in nearly every possible way over the original model.
The major improvements include the larger surface area for the sensor as well as the faster processing time for unlocking the device. It measures 8mm x 8mm, which is quite bigger compared to the 4mm x 9mm surface area on the original model.
With 77 percent more surface area, it should be easier to accurately place the finger on the sensor, allowing it to collect more data while scanning. Coupling this with faster processing, Qualcomm claims that the sensor can offer 50 percent faster unlocking for smartphones.
The company says that the first phones to come with the new 3D Sonic Sensor Gen 2 should be available in “early 2021” but there’s no specific timeline for this. Also, the company has not mentioned any partners but Samsung is expected to be the first to use this sensor for the upcoming Galaxy S21 lineup.
